TO-218 / SOT-93 power package
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Description
SOT-93 is a through-hole mount package between TO-220 and TO-247 in terms of package size. This package is designed to cater to aluminum wire bonding, the standard process technology for high current application devices. This package is capable of carrying high gain and low drive current devices that are extensively used in analog power amplifiers and logic driven power switches.
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TO-218 / SOT-93 power package