TO-251 (IPAK) / TO-252(DPAK) Power Packages
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Description
These low to medium power packages are configured for through-hole (TO-251)or surface-mount (TO-252) applications. The leadframes for these packages have been designed to give the user the choice of either spot silver pad/copper or full nickel plate to cater to gold and aluminum wire bonding process, respectively. Common applications for TO-251 and TO-252 packages are home appliances, personal computers, lighting and automotive systems.
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TO-251 (IPAK) / TO-252(DPAK) Power Packages